In recent years, the rapid growth of compact and sophisticated multifunctional electronic equipment has continued relentlessly. With the technological advances in high-speed, high-density chip designs used in these devices, the via hole or interconnect diameter has also seen a sharp reduction in size. This resulted to requiring the use of φ0.08mm drills in production.rnTo effectively carry out a reliable and high-quality ultra-micro drilling, it is necessary to satisfy three elements: the drill; the printed circuit board (PCB)/sub-ma-terials; and the drilling machine.rnCrucially, the drill needs to be designed using a suitable grade of tungsten carbide material that matches the PCB material being drilled. The drill should also allow the correct geometry to be used with special focus on all key angles like the analysis from a highspeed camera as shown in Fig. 1.
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