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Piezoelectric evaluation of ion beam etched Pb(Zr,Ti)O_3 thin films by piezoresponse force microscopy

机译:压电响应力显微镜对离子束刻蚀Pb(Zr,Ti)O_3薄膜的压电评估

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摘要

The evolution of piezoelectric properties of Pb(Zr,Ti)O_3 (PZT) thin films after ion beam etching have been investigated at the nanoscale level by piezoelectric force microscopy. A comparison of the piezoelectric properties on etched and unetched films is realized. Piezoelectric contrasts imaging evidences a modification of the domain architecture at the film surface. Local piezoelectric hysteresis loops measurements on grains indicate that the coercive voltage for switching is much higher for the etched films (2.3 V) compared to the unetched ones (1.0 V) while the average piezoelectric activity is slightly lower. The results are explained in terms of grain-damaging during etching and domain-wall pinning.
机译:通过压电力显微镜研究了离子束刻蚀后Pb(Zr,Ti)O_3(PZT)薄膜的压电性能演变。实现了蚀刻膜和未蚀刻膜上压电性能的比较。压电对比成像证明了膜表面域结构的改变。晶粒上的局部压电磁滞回线测量表明,与未蚀刻的薄膜(1.0 V)相比,蚀刻的薄膜(2.3 V)的开关矫顽电压要高得多,而平均压电活性稍低。用蚀刻和畴壁钉扎期间的晶粒破坏来解释结果。

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