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Surface modification of Al-20Si alloy by high current pulsed electron beam

机译:大电流脉冲电子束对Al-20Si合金的表面改性

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摘要

Hypereutectic AI-20Si (Si 20 wt%, Al balance)alloy surface was treated with high current pulsed electron beam (HCPEB) under different pulse numbers. The results indicate that HCPEB irradiation induces the formation of metastable structures on the treated surface. The coarse primary Si particle melts, producing a "halo" microstructure with primary Si as the center on the melted surface. A supersaturated solid solution of Al is formed in the melted layer caused by Si atoms dissolving into the Al matrix. Cross-section structure analysis shows that a 4 u,m remelted layer is formed underneath the top surface of the HCEPB-treated sample. Compared with the matrix, the Al and Si elements in the remelted layer are distributed uniformly. In addition, the grains of the AI-20Si alloy surface are refined after HCPEB treatment, as shown by TEM observation. Nano-silicon particles are dispersed on the surface of remelted layer. Polygonal subgrains, approximately 50-100 nm in size, are formed in the Al matrix. The hardness test results show that the microhardness of the ot(Al) and eutectic structure is increased with increasing pulse number. The hardness of the "halo" microstructure presents a gradient change after 15 pulse treatment due to the diffusion of Si atoms. Furthermore, hardness tests of the cross-section at different depths show that the microhardness of the remelted layer is higher than that of the matrix. Therefore, HCPEB technology is a good surface modification method for enhancing the surface hardness of hypereutectic Al-20Si alloy.
机译:用不同脉冲数的高电流脉冲电子束(HCPEB)处理过共晶AI-20Si(Si 20 wt%,Al平衡)合金表面。结果表明,HCPEB辐照诱导了被处理表面上亚稳结构的形成。粗大的初生Si颗粒熔化,在初生Si的中心形成一个“晕”的微观结构。 Al的过饱和固溶体是由Si原子溶解到Al基体中而形成的。横截面结构分析表明,在经过HCEPB处理的样品顶面下方形成了一个4 µm的重熔层。与基体相比,重熔层中的Al和Si元素分布均匀。另外,如通过TEM观察所示,在HCPEB处理之后,AI-20Si合金表面的晶粒被细化。纳米硅颗粒分散在重熔层的表面上。在Al基体中形成了大约50-100 nm大小的多边形亚晶粒。硬度测试结果表明,随着脉冲数的增加,ot(Al)和共晶组织的显微硬度增加。由于硅原子的扩散,“光晕”显微组织的硬度在15次脉冲处理后呈现出梯度变化。此外,在不同深度的横截面的硬度测试表明,重熔层的显微硬度高于基体的显微硬度。因此,HCPEB技术是提高过共晶Al-20Si合金表面硬度的良好表面改性方法。

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  • 来源
    《Applied Surface Science》 |2011年第9期|p.3913-3919|共7页
  • 作者单位

    School of Materials and Metallurgy, Northeastern University, Shenyang, 110004. China;

    School of Materials and Metallurgy, Northeastern University, Shenyang, 110004. China;

    School of Materials and Metallurgy, Northeastern University, Shenyang, 110004. China;

    School of Materials and Metallurgy, Northeastern University, Shenyang, 110004. China;

    Key Laboratory of the Ministry of Education of Materials Modification by Laser, Ion and Electron Beams Dalian University ofTechnology, Dailan 116024, China;

    Key Laboratory of the Ministry of Education of Materials Modification by Laser, Ion and Electron Beams Dalian University ofTechnology, Dailan 116024, China;

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  • 原文格式 PDF
  • 正文语种 eng
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  • 关键词

    High current pulsed electron beam; AI-20SI alloy; Surface modification; Metastable structures; Microhardness;

    机译:大电流脉冲电子束;AI-20SI合金;表面改性;亚稳结构;显微硬度;

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