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Sub-nanosecond pulse programming and device design strategy for analog resistive switching in HfO_x-based resistive random access memory

机译:基于HfO_x的电阻式随机存取存储器中模拟电阻切换的亚纳秒脉冲编程和器件设计策略

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摘要

The analog switching behavior of resistive random access memory (RRAM) is crucial for its application in neuromorphic computing. This paper investigates the switching mechanism of RRAM under sub-nanosecond and nanosecond pulse programming, with selected device materials and structures, using the kinetic Monte Carlo simulation method. The microscopic distribution of oxygen vacancies is simulated in all three spatial dimensions and in the time dimension (four-dimensional). According to the simulation results, thermal effects are a critical factor affecting the switching behavior. The thermal effects inside the HfOx switching layer can be almost completely eliminated by using sub-nanosecond pulses with low voltage, finally leading to good analog behavior. When nanosecond pulses are applied, effective heat insulation is the key to realizing analog characteristics. In general, the switching process is proposed to involve three stages. Having the lowest energy consumption, the first stage shows the greatest potential for achieving analog behavior. The use of heat-isolating structures, like capping layers and side wall materials with lower thermal conductance, could be a solution to improve the analog behavior of RRAM at the first stage when down-scaling the device size. Published under license by AIP Publishing.
机译:电阻性随机存取存储器(RRAM)的模拟开关行为对其在神经形态计算中的应用至关重要。本文使用动力学蒙特卡罗模拟方法研究了亚纳秒和纳秒脉冲编程下RRAM的切换机制,并选择了器件的材料和结构。在所有三个空间维度和时间维度(四个维度)中模拟了氧空位的微观分布。根据仿真结果,热效应是影响开关行为的关键因素。通过使用低电压的亚纳秒脉冲,几乎可以完全消除HfOx开关层内部的热效应,最终导致良好的模拟性能。当施加纳秒脉冲时,有效的隔热是实现模拟特性的关键。通常,提议切换过程包括三个阶段。能耗最低,第一阶段显示出实现模拟行为的最大潜力。当减小器件尺寸时,在第一阶段使用隔热结构(如覆盖层和导热系数较低的侧壁材料)可能是提高RRAM模拟性能的一种解决方案。由AIP Publishing授权发布。

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  • 来源
    《Applied Physics Letters》 |2019年第11期|112102.1-112102.5|共5页
  • 作者单位

    Dalian Univ Technol, Sch Microelect, Dalian 116024, Peoples R China;

    Dalian Univ Technol, Sch Microelect, Dalian 116024, Peoples R China;

    Tsinghua Univ, Inst Microelect, Beijing 100084, Peoples R China;

    Dalian Univ Technol, Sch Microelect, Dalian 116024, Peoples R China;

    Dalian Univ Technol, Sch Microelect, Dalian 116024, Peoples R China;

    Dalian Univ Technol, Sch Energy & Power Engn, Key Lab Ocean Energy Utilizat & Energy Conservat, Minist Educ, Dalian 116024, Peoples R China;

    Fudan Univ, Shanghai Inst Intelligent Elect & Syst, State Key Lab ASIC & Syst, Shanghai 200433, Peoples R China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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