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Improvement of durability and switching speed by incorporating nanocrystals in the HfO_x based resistive random access memory devices

机译:通过在基于HfO_x的电阻式随机存取存储设备中加入纳米晶体,提高了耐用性和切换速度

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摘要

Resistive random access memory (RRAM) has attracted significant interest for next-generation nonvolatile memory applications. However, it is somehow difficult to design a high speed RRAM device with enhanced data reliability. This paper deals with the improvement of high speed durable switching in nanocrystals based RRAM (NC-RRAM) devices. The high performance RRAM devices were prepared by incorporating the NCs into the HfOx oxide layer. As compared to the without (w/o) NC devices, the NC-RRAM devices are capable to execute uniform switching with higher set speed of 100 ns and reset speed of 150 ns, longer retention time and higher endurance of 10(8) cycles at 85 degrees C. The possible switching mechanism is due to the formation and rupture of the conductive filaments (CFs) inside the oxide film. The improvement of the NC-RRAM devices is due to the enhanced electric field intensity on the surface of the NCs, which can effectively facilitate the formation and rupture of the CFs. Published by AIP Publishing.
机译:电阻式随机存取存储器(RRAM)已引起下一代非易失性存储器应用的极大兴趣。然而,以某种方式设计具有增强的数据可靠性的高速RRAM设备是困难的。本文研究了基于纳米晶体的RRAM(NC-RRAM)器件中高速持久开关的改进。通过将NC整合到HfOx氧化物层中来制备高性能RRAM器件。与不带(w / o)NC设备的设备相比,NC-RRAM设备能够以100 ns的较高设置速度和150 ns的复位速度,更长的保留时间以及10(8)个周期的更高耐用性执行均匀切换温度为85摄氏度。可能的开关机制是由于氧化膜内部的导电丝(CFs)的形成和破裂。 NC-RRAM设备的改进归因于NC表面上增强的电场强度,可以有效地促进CF的形成和破裂。由AIP Publishing发布。

著录项

  • 来源
    《Applied Physics Letters》 |2018年第2期|023105.1-023105.5|共5页
  • 作者单位

    Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China;

    Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China;

    Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China;

    Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China;

    Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China;

    Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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