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Identification of trapping defects in 4H-silicon carbide metal-insulator-semiconductor field-effect transistors by electrically detected magnetic resonance

机译:通过电检测磁共振识别4H碳化硅金属绝缘体半导体场效应晶体管中的俘获缺陷

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摘要

In conventional Si/SiO_2-based metal oxide semiconductor devices, performance-limiting semiconductor/dielectric interface traps are localized precisely at the Si/SiO_2 boundary. The authors show that in high-quality SiC/SiO_2-based devices, this is not necessarily the case. Magnetic resonance and electrical measurements indicate that in relatively high quality 4H-SiC metal-insulator-semiconductor field-effect transistors, there exist relatively high concentrations of intrinsic deep level defect centers extending below the SiC/SiO_2 interface into the SiC bulk. The primary defect observed is almost certainly an intrinsic defect of high symmetry, most likely a silicon vacancy center.
机译:在常规的基于Si / SiO_2的金属氧化物半导体器件中,限制性能的半导体/介电界面陷阱被精确地定位在Si / SiO_2边界处。作者表明,在高质量的SiC / SiO_2基器件中,情况并非一定如此。磁共振和电学测量表明,在相对高质量的4H-SiC金属-绝缘体-半导体场效应晶体管中,存在着较高浓度的本征深能级缺陷中心,这些缺陷中心在SiC / SiO_2界面下方延伸到SiC块体内。观察到的主要缺陷几乎可以肯定是高对称性的固有缺陷,很可能是硅空位中心。

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