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Effect of surface morphology on the fracture strength of silicon nanobeams

机译:表面形态对硅纳米束断裂强度的影响

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The effect of nanoscale surface morphology on the fracture strength of 190-nm-thick, doubly clamped Si beams was measured experimentally. The surface morphology was controlled through aqueous etching and characterized by atomic force microscopy. The beams fractured along the primary cleavage planes, {111}. Fracture strength was extracted using finite element simulations of the experiment. Nanobeams etched with relatively smooth morphologies (0.4 nm rms) were able to sustain a tensile stress of 15.8 GPa, close to theoretical strengths predicted by previous atomistic calculations. In contrast, nanobeams decorated with nanometer-high step bunches (1.5 nm rms) had a 20% lower fracture strength, 12.8 GPa, suggesting that careful attention to processing is necessary for maximum strength.
机译:实验测量了纳米级表面形貌对厚度为190 nm的双束夹层Si光束的断裂强度的影响。通过水蚀刻控制表面形态,并通过原子力显微镜表征。光束沿主劈裂面{111}断裂。使用实验的有限元模拟提取断裂强度。蚀刻具有相对平滑形态(0.4 nm rms)的纳米束能够承受15.8 GPa的拉应力,接近先前原子计算所预测的理论强度。相比之下,用纳米级台阶束(1.5 nm rms)装饰的纳米束的断裂强度降低了20%,为12.8 GPa,这表明为获得最大强度,必须谨慎处理。

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