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Current-voltage characteristics of n lateral polarity junctions in GaN

机译:GaN中n / n个横向极性结的电流-电压特性

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Lateral Si:N-polar/Si:Ga-polar GaN homojunctions were fabricated using metal organic chemical vapor deposition with nitrogen as the carrier and dilution gas. Nominally undoped N-polar areas are n-type conductive, while nominally undoped Ga-polar areas are insulating with carrier densities below 1 X 10~(15) cm~(-3). This allows for the fabrication of selectively doped areas within one growth step that can be used to fabricate novel lateral device structures or enhance existing Ⅲ-N-device structures. In this letter we investigated the electrical properties of the simplest case of these junctions, namely, when both sides are n-type conductive. The results of the Ⅳ measurements show a linear characteristic both for the measurement of a N-polar/Si:Ga-polar junction and a N-polar/ Si:Ga-polar/N-polar double junction. This result indicates that, as expected, there are no energy barriers between the N-polar and the Ga-polar material and that these structures can be used to achieve laterally selective doped areas in Ga-N for electronic device applications.
机译:使用金属有机化学气相沉积法,以氮气为载体和稀释气体,制造横向Si:N极性/ Si:Ga极性GaN同质结。标称未掺杂的N极区是n型导电性,标称未掺杂的Ga极区是绝缘的,载流子密度低于1 X 10〜(15)cm〜(-3)。这允许在一个生长步骤中制造选择性掺杂的区域,该区域可用于制造新型的横向器件结构或增强现有的Ⅲ-N器件结构。在这封信中,我们研究了这些结的最简单情况的电学特性,即当两侧均为n型导电时。 Ⅳ测量的结果显示出对于N-极性/ Si:Ga-极性结和N-极性/ Si:Ga-极性/ N-极性双结的测量均具有线性特性。该结果表明,正如预期的那样,在N极和Ga极材料之间没有能垒,并且这些结构可用于在Ga-N中实现用于电子设备应用的横向选择性掺杂区域。

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