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Identification of defect-related emissions in ZnO hybrid materials

机译:鉴定ZnO杂化材料中与缺陷有关的排放

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摘要

ZnO hybrid materials with singly precipitated ZnO nanocrystals embedded in the glass surface were fabricated by melt-quenching method followed by the annealing process. A series of samples containing different densities and species of intrinsic defects were obtained under different annealing conditions in a controllable manner, which was an ideal platform to identify the complicated defect origins. By employing photoluminescence (PL), excitation-dependent PL, PL excitation (PLE), and Raman spectroscopy, the radiative transitions of visible emission bands at around 401, 490, and 528 nm were unambiguously involved with zinc interstitial-related defect levels as initial states, and the corresponding terminal states were suggested to be valence band, oxygen vacancies, and zinc vacancies, respectively. This study may deepen the fundamental understanding of defect-related emissions and physics in ZnO and benefit potential applications of ZnO hybrid materials in optoelectronics.
机译:通过熔融淬火法,然后进行退火工艺,制备了在玻璃表面嵌入单晶沉淀的ZnO纳米晶体的ZnO杂化材料。在不同的退火条件下,以可控的方式获得了一系列包含不同密度和固有缺陷种类的样品,这是鉴定复杂缺陷来源的理想平台。通过采用光致发光(PL),依赖于激发的PL,PL激发(PLE)和拉曼光谱,在401、490和528 nm附近的可见发射带的辐射跃迁明确地与锌间隙相关的缺陷水平有关。态,相应的末端态分别为价带,氧空位和锌空位。这项研究可以加深对ZnO中与缺陷相关的发射和物理的基本理解,并有益于ZnO杂化材料在光电中的潜在应用。

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  • 来源
    《Applied Physics Letters》 |2015年第2期|021902.1-021902.5|共5页
  • 作者单位

    National Laboratory of Solid State Microstructures, Collaborative Innovation Center of Advanced Microstructures, and School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China;

    National Laboratory of Solid State Microstructures, Collaborative Innovation Center of Advanced Microstructures, and Department of Physics, Nanjing University, Nanjing 210093, China,Department of Materials Science and Engineering, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China;

    National Laboratory of Solid State Microstructures, Collaborative Innovation Center of Advanced Microstructures, and School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China;

    National Laboratory of Solid State Microstructures, Collaborative Innovation Center of Advanced Microstructures, and School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China;

    National Laboratory of Solid State Microstructures, Collaborative Innovation Center of Advanced Microstructures, and Department of Physics, Nanjing University, Nanjing 210093, China;

    Department of Materials Science and Engineering, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China;

    National Laboratory of Solid State Microstructures, Collaborative Innovation Center of Advanced Microstructures, and School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China;

    National Laboratory of Solid State Microstructures, Collaborative Innovation Center of Advanced Microstructures, and School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China;

    National Laboratory of Solid State Microstructures, Collaborative Innovation Center of Advanced Microstructures, and School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China,Spintronics and Nanodevice Laboratory, Department of Electronics, University of York, York YO10 5DD, United Kingdom;

    National Laboratory of Solid State Microstructures, Collaborative Innovation Center of Advanced Microstructures, and School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China;

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