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Polarization-induced electrical conductivity in ultra-wide band gap AlGaN alloys

机译:超宽带隙AlGaN合金中极化诱导的电导率

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摘要

Unintentionally doped (UID) AlGaN epilayers graded over Al compositions of 80%-90% and 80%-100% were grown by metal organic vapor phase epitaxy and were electrically characterized using contactless sheet resistance (R_(sh)) and capacitance-voltage (C-V) measurements. Strong electrical conductivity in the UID graded AIGaN epilayers resulted from polarization-induced doping and was verified by the low resistivity of 0.04 Ω cm for the AlGaN epilayer graded over 80%-100% Al mole fraction. A free electron concentration (n) of 4.8 × 10~(17)cm~(-3) was measured by C-V for Al compositions of 80%-100%. Average electron mobility (anti mu) was calculated from R_(sh) and n data for three ranges of Al composition grading, and it was found that UID AlGaN graded from 88%-96% had anti mu = 509 cm~2/V s. The combination of very large band gap energy, high anti mu, and high n for UID graded AlGaN epilayers make them attractive as a building block for high voltage power electronic devices such as Schottky diodes and field effect transistors.
机译:通过金属有机气相外延生长在Al成分上渐变为80%-90%和80%-100%的无意掺杂(UID)AlGaN外延层,并使用非接触薄层电阻(R_(sh))和电容电压( CV)测量。 UID分级的AIGaN外延层中的强电导率是由极化诱导的掺杂引起的,并且对于梯度超过80%-100%Al摩尔分数的AlGaN外延层,其低电阻率为0.04Ωcm进行了验证。对于80%-100%的Al组成,通过C-V测量的自由电子浓度(n)为4.8×10-(17)cm-(-3)。从R_(sh)和n数据计算出三个范围的Al组成分级的平均电子迁移率(anti mu),发现从88%-96%分级的UID AlGaN的anti mu = 509 cm〜2 / V s 。 UID级AlGaN外延层具有非常大的带隙能量,高抗mu和高n的组合,使其成为诸如肖特基二极管和场效应晶体管之类的高压功率电子设备的构建基块具有吸引力。

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  • 来源
    《Applied Physics Letters》 |2016年第22期|222101.1-222101.4|共4页
  • 作者单位

    Sandia National Laboratories, Albuquerque, New Mexico 87185 USA;

    Sandia National Laboratories, Albuquerque, New Mexico 87185 USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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