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首页> 外文期刊>Applied Physics Letters >Light-erasable embedded charge-trapping memory based on MoS_2 for system-on-panel applications
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Light-erasable embedded charge-trapping memory based on MoS_2 for system-on-panel applications

机译:基于MoS_2的可擦擦嵌入式电荷陷阱存储器,用于面板上系统应用

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摘要

The continuous scaling and challenges in device integrations in modern portable electronic products have aroused many scientific interests, and a great deal of effort has been made in seeking solutions towards a more microminiaturized package assembled with smaller and more powerful components. In this study, an embedded light-erasable charge-trapping memory with a high-k dielectric stack (Al_2O_3/HfO_2/Al_2O_3) and an atomically thin MoS_2 channel has been fabricated and fully characterized. The memory exhibits a sufficient memory window, fast programming and erasing (P/E) speed, and high On/Off current ratio up to 10~7. Less than 25% memory window degradation is observed after projected 10-year retention, and the device functions perfectly after 8000 P/E operation cycles. Furthermore, the programmed device can be fully erased by incident light without electrical assistance. Such excellent memory performance originates from the intrinsic properties of two-dimensional (2D) MoS_2 and the engineered back-gate dielectric stack. Our integration of 2D semiconductors in the infrastructure of light-erasable charge-trapping memory is very promising for future system-on-panel applications like storage of metadata and flexible imaging arrays.
机译:现代便携式电子产品中设备集成的不断扩展和挑战已经引起了许多科学兴趣,并且在寻求解决方案方面做出了巨大的努力,以寻求更微型化的封装,该封装具有更小,更强大的组件。在这项研究中,具有高k介电堆栈(Al_2O_3 / HfO_2 / Al_2O_3)和原子上薄的MoS_2通道的嵌入式光可擦除电荷陷阱存储器已被制造并充分表征。存储器具有足够的存储器窗口,快速的编程和擦除(P / E)速度以及高达10〜7的高开关电流比。在预计的10年保留期后,观察不到不到25%的内存窗口降级,并且该设备在8000个P / E操作周期后可以完美运行。此外,无需电辅助,入射光就可以完全擦除已编程的设备。如此出色的存储性能源自二维(2D)MoS_2和工程背栅电介质堆栈的内在特性。我们将2D半导体集成到光可擦除电荷陷阱存储器的基础架构中,对于将来的面板上系统应用(例如元数据存储和灵活的成像阵列)非常有希望。

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  • 来源
    《Applied Physics Letters》 |2017年第22期|223104.1-223104.5|共5页
  • 作者单位

    State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, People's Republic of China;

    State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, People's Republic of China;

    State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, People's Republic of China;

    State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, People's Republic of China;

    State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, People's Republic of China;

    State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, People's Republic of China;

    State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, People's Republic of China;

    Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, People's Republic of China;

    State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, People's Republic of China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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