机译:硅和石英玻璃晶片的室温直接键合
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
Department of Precision Engineering, School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo, Tokyo 113-8656, Japan;
机译:通过两步湿式化学表面清洁技术将硅和石英玻璃低温晶圆直接粘合
机译:电容式压力传感器,具有通过SOI-Si直接晶圆键合和玻璃回流技术的晶圆直通硅通孔
机译:使用用于室温硅晶片直接键合的PTFE基板的含氟等离子体处理
机译:硅的低温直接粘合到石英玻璃晶片通过顺序湿化学表面活化
机译:通过低温芯片对晶圆键合将铟镓砷MSM阵列与硅平台进行3D集成。
机译:金膜厚度和表面粗糙度对室温晶圆键合和金-金表面活化键合的晶圆级真空密封的影响
机译:电容式压力传感器采用SOI-Si直接晶圆键合和玻璃回流技术的晶片通过硅通孔通孔