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Influence of impurities on the high temperature conductivity of SrTiO_3

机译:杂质对SrTiO_3高温导电性的影响

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摘要

In studies of high temperature electrical conductivity (HiTEC) of dielectrics, the impurity in the highest concentration is assumed to form a single defect that controls HiTEC. However, carrier concentrations are typically at or below the level of background impurities, and all impurities may complex with native defects. Canonical defect models ignore complex formation and lump defects from multiple impurities into a single effective defect to reduce the number of associated reactions. To evaluate the importance of background impurities and defect complexes on HiTEC, a grand canonical defect model was developed with input from density functional theory calculations using hybrid exchange correlation functionals. The influence of common background impurities and first nearest neighbor complexes with oxygen vacancies (v_O) was studied for three doping cases: nominally undoped, donor doped, and acceptor doped SrTiO_3. In each case, conductivity depended on the ensemble of impurity defects simulated with the extent of the dependence governed by the character of the dominant impurity and its tendency to complex with v_O. Agreement between simulated and measured conductivity profiles as a function of temperature and oxygen partial pressure improved significantly when background impurities were included in the nominally undoped case. Effects of the impurities simulated were reduced in the Nb and Al doped cases as both elements did not form complexes and were present in concentrations well exceeding all other active impurities. The influence of individual impurities on HiTEC in SrTiO_3 was isolated and discussed and motivates further experiments on singly doped SrTiO_3.
机译:在研究电介质的高温电导率(HiTEC)时,假定浓度最高的杂质会形成控制HiTEC的单个缺陷。但是,载流子浓度通常等于或低于背景杂质的水平,并且所有杂质都可能与天然缺陷复合。规范缺陷模型忽略了复杂的形成过程,将多个杂质中的缺陷块化为一个有效缺陷,以减少相关反应的数量。为了评估背景杂质和缺陷复合物在HiTEC上的重要性,使用混合交换相关函数从密度泛函理论计算的输入中开发了一个大型规范缺陷模型。在三种掺杂情况下研究了常见背景杂质和第一近邻配合物与氧空位(v_O)的影响:名义上未掺杂,施主掺杂和受主掺杂SrTiO_3。在每种情况下,电导率取决于模拟的杂质缺陷的整体,其依赖性程度取决于主要杂质的特性及其与v_O络合的趋势。当名义上无掺杂的情况下包括背景杂质时,作为温度和氧分压的函数的模拟电导率曲线和测量电导率曲线之间的一致性显着提高。在Nb和Al掺杂的情况下,模拟的杂质的影响降低了,因为这两种元素均未形成络合物,并且其浓度远超过所有其他活性杂质。单独讨论并讨论了单个杂质对HiTEC的影响,并激发了进一步研究单掺杂SrTiO_3的实验。

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  • 来源
    《Applied Physics Letters》 |2018年第2期|022902.1-022902.5|共5页
  • 作者单位

    Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27695, USA;

    Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27695, USA;

    Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27695, USA;

    Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27695, USA;

    Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27695, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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