Using JEDEC Level 1 Humidity Life Test Method to Qualify Soldermask Materials for Flip Chip Applications

摘要

Adhesion of the underfill material to the two different solder resists and two different fluxes was measured with single lap shear test usingJEDEC 1-level. The FR4 samples were fluxed with two qualified fluxes and reflowed in reflow oven. The underfill was applied to the substrates and attached together. The curing was done according to the specification of the underfill manufacturer. Two different curing times, 30 and 60 min. were used. The gap between the two substrates was kept constant, 100 um to simulate the gap between the chip and substrate. Half of the samples were placed in the 85 C/85 R.H. humidity chamber for 168 hours before the single lap shear test.