WLFO Packaging Technology- based WLSiP - Enabler for Packaging of I0T/I0E Modules

摘要

Fan-Out Wafer-Level Packaging shows great potential to offer a wide range of package constructions best suitable as packaging solutions for IoT/IoE applications. The design flexibility allows for customization to the specific needs of the customer. High integration density ensures a high level of system integration, ensuring excellent electrical and thermal performance at a reasonable cost as manufactured on large format in batch processing.