Mold Compound High Performance Requirements

摘要

Mold compounds are the plastics used to encapsulate many types of electronic packages, from capacitors and transistors to central processing units (CPUs) and memory devices. The modern mold compound has evolved into a complex formulation containing as many as 20 raw materials and multiple processing steps, each statistically controlled to yield a uniform and predictable end product. At the most basic level, mold compounds contain five classes of raw materials. Organic resins are typically meltable, such as epoxy resin. Fillers are non-melting inorganic materials. Catalysts accelerate the cure reaction. The mold release material allows the naturally adhesive epoxy resin to come out of the mold. The final raw material is a pigment or colorant. Other materials, such as flame retardants, adhesion promoters, ion traps and stress relievers are added to the mold compound as appropriate.