Wafer Bump Reflow

摘要

Preventing and reducing oxidation of bumped wafers during reflow is essential to the success of wafer-level packaging. Both the flux and the hydrogen reflow process are effective for oxide prevention and reduction. Currently, the flux process has presented its users with environmental risks, cleanliness problems and higher operational costs due to added equipment and personnel, as well as the disposal of hazardous waste. The hydrogen reflow process has been shown to be completely safe, clean and cost-effective. End users who use this process have demonstrated high process yields.