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Thermal Conductivity of Graphene-Polymer Composites: Mechanisms, Properties, and Applications

机译:石墨烯-聚合物复合材料的导热系数:机理,性能和应用

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摘要

With the integration and miniaturization of electronic devices, thermal management has become a crucial issue that strongly affects their performance, reliability, and lifetime. One of the current interests in polymer-based composites is thermal conductive composites that dissipate the thermal energy produced by electronic, optoelectronic, and photonic devices and systems. Ultrahigh thermal conductivity makes graphene the most promising filler for thermal conductive composites. This article reviews the mechanisms of thermal conduction, the recent advances, and the influencing factors on graphene-polymer composites (GPC). In the end, we also discuss the applications of GPC in thermal engineering. This article summarizes the research on graphene-polymer thermal conductive composites in recent years and provides guidance on the preparation of composites with high thermal conductivity.
机译:随着电子设备的集成和小型化,热管理已成为至关重要的问题,严重影响其性能,可靠性和寿命。聚合物基复合材料当前的兴趣之一是导热复合材料,它可以消散由电子,光电和光子设备和系统产生的热能。超高导热率使石墨烯成为导热复合材料最有希望的填料。本文综述了石墨烯-聚合物复合材料(GPC)的热传导机理,最新进展以及影响因素。最后,我们还将讨论GPC在热工程中的应用。本文总结了近年来石墨烯-聚合物导热复合材料的研究,为高导热复合材料的制备提供指导。

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