Interactive Field Effect of Atomic Bonding Forces on the Equivalent Elastic Modulus Estimation of Micro-Level Single-Crystal Copper by Utilizing Atomistic-Continuum Finite Element Simulation

摘要

This study uses the finite element analysis (FEA)-based atomistic-continuum method (ACM) combined with the Morse potential of metals to determine the effects of the elastic modulus (E) of a given example on atomic-level single-crystal copper (Cu). This work aims to overcome the estimated drawback of a molecular dynamic calculation applied to the mechanical response of macro in-plane-sized and atomic-level-thick metal-based surface coatings. The interactive energy of two Cu atoms within a face-centered metal lattice was described by a mechanical response of spring stiffness. Compared with the theoretical value, the parameters of the Morse potential dominated the predicted accuracy through the FEA-based ACM. Moreover, the analytic results indicated that the effective E of a single-crystal Cu was significantly sensitive to the given range of the interactive force field among atoms. The reliable elastic moduli of 86.8, 152.6, and 205.2 GPa along the Cu(100), Cu(110), and Cu(111) orientations of the Cu metal were separately acquired using the presented FEA-based ACM methodology.