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The Effect of Chip Binding on the Parameters of the Case-Hardened Layer of Tooth Surfaces for AMS 6308 Steel Gears Processed by Thermochemical Treatment

机译:芯片绑定对通过热化学处理加工的AMS 6308钢齿轮齿表面壳体表面的参数

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摘要

The following article describes influence of pressure welded or bound chips to the gear tooth flank and/or the tooth root on a carburized case and surface layer hardness of Pyrowear 53 steel gears, machined by Power Skiving method. This paper is focused only on one factor, the chips generated while forming gear teeth by power skiving, which could result in local changes in the carburized case parameters as a negatively affecting point of mechanical performance of the carburized case. The chips, due to the specifics of the power skiving process and the kinematics of tooth forming, could be subject to the phenomena of pressure welding or binding of chips to the tooth. During the carburizing stage of the downstream manufacturing processes, the chips form a diffusion barrier, which ultimately could result in localized changes in the carburized case. This work was an attempt to answer the question of how and to what extent the chips affect the case hardening. Performed simulations of chips by a generating cupper “spots”, mentioned in the study, represent a new approach in connection with minimization of errors, which could appear during carbon case depth and case hardness analysis for typical chips, generated during the machining process—assurance that a complete chip was bound to the surface. Hardness correlation for zones, where the chip appears with areas free of chips, gives simple techniques for assessment. Performed tests increased the knowledge about the critical size of the chip—1.5 mm, which could affect the case hardening. Obtained experimental test results showed that the appearance of chip phenomena on the gear tooth might have a negative impact on a carburized case depth and hardened layer.
机译:下面的文章介绍了通过动力挖掘方法加工的渗碳壳体和/或齿根对齿轮齿侧和/或齿根的影响,通过动力挖掘方法加工。本文仅集中在一个因素上,在通过动力滑动形成齿轮齿的同时产生的芯片,这可能导致渗碳壳体参数的局部变化作为渗碳壳体的机械性能的负面影响。芯片,由于动力挖掘过程和牙齿形成的运动学的细节,可能受到压力焊接的现象或芯片与牙齿的结合。在下游制造工艺的渗碳阶段,芯片形成扩散屏障,这最终可能导致渗碳壳体的局部变化。这项工作试图回答如何以及在多大程度上如何以及在多大程度上影响案例硬化。通过在研究中提到的生成带“斑点”进行芯片的模拟,代表了一种与最小化误差的新方法,这可能出现在碳壳深度和典型芯片的壳体硬度分析中,在加工过程保证期间产生的典型芯片完整的芯片绑定到表面。区域的硬度相关性,芯片出现在没有芯片的区域,为评估提供简单的技术。执行的测试增加了关于芯片-1.5mm的临界大小的知识,这可能影响壳体硬化。获得的实验测试结果表明,齿轮齿上的芯片现象的外观可能对渗碳壳深度和硬化层产生负面影响。

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