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Weld Formation Mechanism and Microstructural Evolution of TC4/304 Stainless Steel Joint with Cu-Based Filler Wire and Preheating

机译:铜基焊丝与预热TC4 / 304不锈钢接头的焊接形成机理及组织演变

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摘要

Ti-Fe intermetallic compounds were effectively suppressed with Cu-based filler wire and weld formation was greatly improved with the preheating of substrates when joining TC4 titanium alloy and 304 stainless steel. A Ti/Cu transition zone consisting of complex TiCu, Ti Cu , TiFe, and TiFe phases was formed between Cu-weld/TC4 interface, while Cu-weld/304ss interface was mainly composed of α-Fe and ε-Cu solid solution. At lower heat input, the undercut defect in back surface had potential to cause crack initiation and joint fracture. Though increasing heat input would improve weld morphology, the formation of thick interfacial reaction layer and weld cracking led to low weld quality and joint strength. The preheating of substrates had an obvious effect on wetting ability of liquid filler metal and could achieve a better weld quality at lower heat input. The back formation of weld was improved to decrease the occurrence of weld defects. The highest tensile strength of 365 MPa occurred at welding heat input of 0.483 kJ/cm, increasing by 47% compared to the joint without preheating. The interfacial reaction mechanism was discussed to reveal the relationship between microstructural characteristics and fracture behavior of Ti/steel welded joints with Cu-based filler wire.
机译:铜基填充焊丝可有效抑制Ti-Fe金属间化合物,并且在将TC4钛合金和304不锈钢连接在一起时,通过预热基材可大大改善焊缝形成。在Cu-weld / TC4界面之间形成了由TiCu,Ti Cu,TiFe和TiFe复相组成的Ti / Cu过渡区,而Cu-weld / 304ss界面主要由α-Fe和ε-Cu固溶体组成。在较低的热量输入下,背面的底切缺陷可能会引起裂纹萌生和接头断裂。尽管增加热量输入将改善焊缝形态,但是厚的界面反应层的形成和焊缝开裂导致焊缝质量和接头强度降低。基体的预热对液态填充金属的润湿能力有明显的影响,并且在较低的热输入下可以获得更好的焊接质量。改善了焊缝的背面形成,以减少焊缝缺陷的发生。焊接输入热量为0.483 kJ / cm时,最高抗拉强度为365 MPa,与不进行预热的接头相比,增加了47%。讨论了界面反应机理,揭示了钛基/铜基焊丝焊接接头的显微组织特征与断裂行为之间的关系。

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