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In Situ Microgravimetric Study of Ion Exchanges in the Ternary Cu-In-S System Prepared by Atomic Layer Deposition

机译:原子层沉积法制备三元Cu-In-S体系中离子交换的原位微重力研究

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摘要

Reaction mechanisms during the growth of multinary compounds by atomic layer deposition can be complex, especially for sulfide materials. For instance, the deposition of copper indium disulfide (CuInS ) shows a non-direct correlation between the cycle ratio, the growth per cycle of each binary growth cycles, i.e., Cu S and In S , and the film composition. This evidences side reactions that compete with the direct Atomic Layer Deposition (ALD) growth reactions and makes the deposition of large films very challenging. To develop a robust upscalable recipe, it is essential to understand the chemical surface reactions. In this study, reaction mechanisms in the Cu-In-S ternary system were investigated in-situ by using a quartz crystal microbalance system to monitor mass variations. Pure binary indium sulfide (In S ) and copper sulfide (Cu S) thin film depositions on Al O substrate were first studied. Then, precursors were transported to react on Cu S and In S substrates. In this paper, gas-phase ion exchanges are discussed based on the recorded mass variations. A cation exchange between the copper precursor and the In S is highlighted, and a solution to reduce it by controlling the thickness deposited for each stack of binary materials during the CuInS deposition is finally proposed.
机译:通过原子层沉积在多元化合物生长过程中的反应机理可能很复杂,尤其是对于硫化物材料而言。例如,二硫化铜铟(CuInS)的沉积显示出循环比,每个二元生长循环的每个循环的生长即Cu S和In S与膜组成之间的非直接相关性。这证明了与直接原子层沉积(ALD)生长反应竞争的副反应,使大膜的沉积非常具有挑战性。要开发出可靠的可升级配方,必须了解化学表面反应。在这项研究中,通过使用石英晶体微量天平系统监测质量变化,就地研究了Cu-In-S三元系统中的反应机理。首先研究了在Al O衬底上的纯二元硫化铟(In S)和硫化铜(Cu S)薄膜沉积。然后,将前体运输以在Cu S和In S衬底上反应。在本文中,基于记录的质量变化讨论了气相离子交换。重点介绍了铜前驱体与In S之间的阳离子交换,最后提出了一种解决方案,通过控制在CuInS沉积过程中为二元材料的每个堆叠沉积的厚度来减少铜前体。

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