Shear bond strength of a bracket-bonding system cured with a light-emitting diode or halogen-based light-curing unit at various polymerization times

机译：在不同的聚合时间用发光二极管或卤素基光固化单元固化的支架粘合体系的剪切粘合强度

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摘要

PurposeTo determine and compare the shear bond strength (SBS) of bracket-bonding system cured with light-emitting diode (LED) and halogen-based light-curing unit at various polymerization times.

机译：目的确定并比较在不同聚合时间用发光二极管（LED）和卤素基光固化单元固化的托槽粘结体系的剪切粘结强度（SBS）。

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期刊名称 Clinical Cosmetic and Investigational Dentistry
作者
Sanjay Prasad Gupta; Basanta Kumar Shrestha;
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作者单位

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年(卷),期 2018(10),-1
年度 2018
页码 61–67
总页数 7
原文格式 PDF
正文语种
中图分类口腔科;牙科材料学;
关键词
shear bond strength halogen-curing light LED-curing light polymerization time;

机译：剪切粘结强度;卤素固化灯;LED固化灯;聚合时间;

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专利

1. Shear bond strength of a bracket-bonding system cured with a light-emitting diode or halogen-based light-curing unit at various polymerization times [J] . Sanjay Prasad Gupta, Basanta Kumar Shrestha Clinical, Cosmetic and Investigational Dentistry . 2018,第10期

机译：在不同聚合时间用发光二极管或卤素基光固化单元固化的托槽粘合体系的剪切粘合强度
2. Effect of curing time on the bond strength of a bracket-bonding system cured with a light-emitting diode or plasma arc light. [J] . DallIgna CM, Marchioro EM, Spohr AM, European journal of orthodontics . 2011,第1期

机译：固化时间对用发光二极管或等离子弧光固化的支架粘合系统的粘合强度的影响。
3. Effect of curing time on the bond strength of a bracket-bonding system cured with a light-emitting diode or plasma arc light [J] . The European Journal of Orthodontics . 2011,第1期

机译：固化时间对用发光二极管或等离子弧光固化的托槽粘结体系的粘结强度的影响
4. Shear Bond Strength of Orthodontic Bonding Materials Polymerized by High-Intensity LEDs at Different Intensities and Curing Times [C] . Borisorn Udomthanaporn, Passiri Nisalak, Pornrachanee Sawaengkit International Conference on Material Science and Engineering . 2017

机译：通过高强度LED在不同强度和固化时间聚合的正畸粘合材料的剪切粘合强度
5. Polymerization with the argon laser: Curing time and shear bond strength. [D] . Lalani, Nazir. 1998

机译：氩激光聚合：固化时间和剪切粘合强度。
6. Comparison of the bonding strengths of second- and third-generation light-emitting diode light-curing units [O] . Hee-Min Lee, Sang-Cheol Kim, Kyung-Hwa Kang, 2016

机译：第二代和第三代发光二极管光固化单元粘合强度的比较
7. Evaluation of Different Light-Curing Units—Light-Emitting Diodes and Quartz–Tungsten–Halogen-Based Light-Curing Units in Polymerization of Posterior Composite: An In Vitro Study [O] . R. Bansal, M. Bansal, S. Walia, 2018

机译：不同光固化单位发光二极管和石英 - 钨 - 卤素光固化单元在后复合材料的聚合中的光纤 - 体外研究
8. Integrated Instrumentation System for the Development of Ionic Polarized Polymer Light-Emitting Diodes [R] . Yang, Y. 1999

机译：用于离子偏振聚合物发光二极管开发的集成仪表系统

Shear bond strength of a bracket-bonding system cured with a light-emitting diode or halogen-based light-curing unit at various polymerization times

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