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Microwave Backscatter-Based Wireless Temperature Sensor Fabricated by an Alumina-Backed Au Slot Radiation Patch

机译:氧化铝背的Au槽辐射贴片制造的基于微波反向散射的无线温度传感器

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摘要

A wireless and passive temperature sensor operating up to 800 °C is proposed. The sensor is based on microwave backscatter RFID (radio frequency identification) technology. A thin-film planar structure and simple working principle make the sensor easy to operate under high temperature. In this paper, the proposed high temperature sensor was designed, fabricated, and characterized. Here the 99% alumina ceramic with a dimension of 40 mm × 40 mm × 1 mm was prepared in micromechanics for fabrication of the sensor substrate. The metallization of the Au slot patch was realized in magnetron sputtering with a slot width of 2 mm and a slot length of 32 mm. The measured resonant frequency of the sensor at 25 °C is 2.31 GHz. It was concluded that the resonant frequency decreases with the increase in the temperature in range of 25–800 °C. It was shown that the average sensor sensitivity is 101.94 kHz/°C.
机译:提出了一种可在高达800°C的温度下工作的无线和无源温度传感器。该传感器基于微波反向散射RFID(射频识别)技术。薄膜平面结构和简单的工作原理使传感器易于在高温下操作。在本文中,设计,制造和表征了所提出的高温传感器。在这里,用微力学制备了尺寸为40 mm×40 mm×1 mm的99%氧化铝陶瓷,用于制造传感器基板。 Au狭缝贴片的金属化是通过磁控溅射实现的,狭缝宽度为2mm,狭缝长度为32mm。在25°C下测得的传感器谐振频率为2.31 GHz。结论是,在25–800°C范围内,谐振频率随温度的升高而降低。结果表明,平均传感器灵敏度为101.94 kHz /°C。

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