A new type of hybrid SiC foam-SiC particles-Al composites used as an electronic packaging substrate material were fabricated by squeeze casting technique. The mechanical properties and the fracture mechanism of the hybrid composites were investigated. The influence of SiC particles and foam hybrid reinforcement on the behavior of the composites was studied. The results show that the interface bonding in the hybrid composites is good for the composites with the unique double interpenetrating structure. The compressive strength of the hybrid composite reinforced by the SiC with the volume fraction of 59.9% is 680 MPa,which is higher than that of any other composites with the same volume fraction of SiC particles reinforcement.
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