首页> 中文期刊> 《印制电路信息》 >谈无铅焊锡回流焊后锡面发黄

谈无铅焊锡回流焊后锡面发黄

         

摘要

热风整平焊锡是在PCB表面形成一层既抗铜氧化, 又可提供良好的可焊性的涂覆层.随着家电产品类终端客户对产品焊接可靠性严格的要求, 外观的严格标准也渐渐纳入整个产品的质量需求.往往许多热风整平焊锡产品在经过高温后, 比如一次回流焊而发生锡面的发黄, 在空气中放置一段时间后, 发黄更加严重或发紫.本文主要讨论锡面发黄的关键因子, 并提出一些参考解决方案.%Hot air solder leveling is the coated solder on PCB surface process which form a layer of copper oxidation resistance layer, and it can provide good weldability. As the electronic products end customers pose strict requirements, and the reliability of the product welding appearance has grown into the strict standards of the entire product quality requirements. Constantly many tin products after high temperature, such as reflow soldering, occurs tin yellowed on the surface, when placed in the air after a period of time, it is more serious or has black yellow defect. This article focuses on the key factors of the tin surface yellowing, and puts forward some solution suggestions for the reference.

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