酸性蚀刻线宽补偿与蚀刻因子、铜厚及线间距关系研究

摘要

This paper has done a research on line width compensation of subtractive process in PCB industry. Pointing out the relationships between compensation and E-factor, copper thickness and line space, it uses 3 formulas to express them. The results do not only supply us guidance for compensation design before manufacturing, but also show us a research direction about thick copper board’s compensation.%　　文章从蚀刻因子，铜厚以及线间距入手，研究了线宽补偿和这三个因素的关系，并使用公式表述，从而可指导酸性蚀刻减成法线宽补偿的工程设计，并为后续研究103µm (3oz/ft²)以上厚铜板的补偿提供了方向。