BGA密集孔耐热性能影响因素分析

摘要

This article analyzes the factors affecting heat resistance of dense holes at BGA area. Considering the process parameters of multi laminating, mechanical drilling and wet processing etc, apply DOE method to conifrm their inlfuence degree on heat resistance , optimize process parameters and improve hole's heat resistance at BGA area.%文章以球栅阵列（BGA）密集孔耐热性能影响因素进行分析，考虑多层压合、机械钻孔、湿处理等工艺流程参数对耐热性能的影响，通过DOE方式，确定各制程对耐热性的影响程度，优化加工参数，改善BGA孔耐热性能。