烧成工艺制度对无铅银导体浆料性能的影响

摘要

The silver thick film conductor paste was made with the ultrafine silver powders prepared by self - designed DC arc plasma evaporation device. The influences of peak firing temperature and sintering holding time on the properties of the thick film were studied systematically. The SEM and DSC were employed to observe the surface morphology and to determine the firing schedule. The results show that, with the increase of peak firing temperature and sintering holding time, the sheet resistivity of the conductor is first decreased and then increased, the weldability, soldering resistance are good first and then trending deterioration. The preferable paste sintering technology is recommended that peak firing temperature is 850℃ and sintering holding time is 20 min.%以直流电弧等离子体法自制的超细银粉为原料,固定浆料配比及制备工艺,通过改变浆料烧成工艺制度,结合扫描电子显微镜( SEM)、差热分析(DSC)等分析手段,系统研究了烧成峰值温度和保温时间对最终烧成厚膜导体性能的影响.结果表明,随着烧成峰值温度升高,保温时间延长,导体膜层方阻先减小,后增大；可焊性、耐焊性也具有先变好后变差的趋势.推荐较好的烧成工艺制度为:烧成峰值温度为850℃,保温20 min.