扇出型封装作为当下先进的封装技术,受到各大封测企业的追捧及相关科研人员的关注.扇出封装工艺技术近几年已得到大力发展,但针对扇出型封装散热性能的研究报道却较少.针对射频系统的扇出封装结构,运用数值仿真软件icepak对封装结构建立相应的实体模型,分析结构中的塑封料(EMC)厚度、热源芯片厚度、焊球布局、散热孔等各参数对系统热性能影响.并利用软件提取封装的热阻网络.通过对比仿真结果,得出扇出封装较倒装焊散热能力提高30％～40％,且散热孔、热沉、焊球布局对封装的热性能影响较大.%As an advanced packaging technology, fan-out packaging is being pursued by enterprises and paid attention by many researchers. Process technologies of fan-out packaging have been developed in the recently several years. However,there are few reports on the thermal performance of system in packaging based on fan-out technology. The thermal performance of radio frequency system based on fan-out technology is studied by using the numerical simulation software,Ansys icepak. Several influence factors are discussed including the thickness of the epoxy molding compound (EMC), the thickness of the heating chip, the layout of the solder balls and the thermal vias, etc. The junction temperature of each model and the thermal resistance network of the packaging are obtained by solving models. Comparing the results of simulation, the heat dissipation for fan-out structure is better 30％～40％ than flip-chip packaging one and the thermal vias, heat sinks and solder ball layout greatly affect the thermal performance of the packaging.
展开▼
