[1]Key Laboratory for Precision and Non-traditional Machining of Ministry of Education, Dalian University of Technology, Dalian 116024, China;
[1]Key Laboratory for Precision and Non-traditional Machining of Ministry of Education, Dalian University of Technology, Dalian 116024, China;
[1]Key Laboratory for Precision and Non-traditional Machining of Ministry of Education, Dalian University of Technology, Dalian 116024, China;
[2]College of Engineering, Southern University of Science and Technology, Shenzhen 518055, China;
Silicon wafer; Subsurface crack; Cleavage; Inclination angle; Thermal energy;