The best process can be obtained by contrast of different machining methods. Slicing process can use multi-wire sawing method and combination of multi-wire sawing and ultrasonic sawing. Double-side lapping can achieve low warp and ELJD grinding can realize high velocity, efficiency and surface quality, so they are widely used in grinding process. By the use of chemical mechanical polishing super smooth surface can be obtained in polishing during which course polishing aims at high efficiency while improving surface quality is the target of fine polishing. The existing problem of SiC substrates is analyzed and the trend of ultra-precision machining is pointed out.%通过对比不同的加工方法获得最佳工艺:切片采用多线切割或者多线切割与超声切割相结合；磨削采用双面研磨获得较低翘曲度的表面或ELID磨削实现高速、高效、高质量磨削；抛光工艺使用化学机械抛光方法,通过粗抛提高加工效率,精抛提高表面质量,从而获得超光滑表面.分析了碳化硅衬底加工存在的问题并指出超精密加工的发展趋势.
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