电子元件焊接质量的自动光学检测系统研究

摘要

To meet the requirement for high density,miniaturization and zero defect of electronic components,an automated optical inspecting system is designed for identifying the soder defects of electronic components on printed circuit board such as missing component ,excessive solder, insufficient solder,open solder etc.ln this system,the images of printed circuit board are obtained by the image-aquisition system and the detecting window is extracted,which features evaluated by image processing techniques are utilized to measure and identify the size of its features.After comparing with the standard data, judge shall be done on the quality of surface soldering whether it is qualified or not. Theproposed system can satisfy the manufacturing requirement for smooth performance ,convenient operation, intelligence and modularization.%为满足表面贴装电子元件的高密度化、小型化、零缺陷等要求,设计一种电子元件焊接质量的自动光学检测系统,可将缺件、多锡、少锡、假焊等焊接缺陷检查出来.该系统首先通过图像采集系统获取电路板图像,并提取元件的检测窗口,通过图像处理得到相应的图像特征,对其特征进行尺寸的测量和识别,然后与标准数据进行比较,判断元件表面焊接质量是否合格,以达到检测元件的目的.系统具有运行平稳、操作方便、智能化和模块化等特点,满足实际生产的需要.