改性热固性酚醛树脂热熔胶膜成膜工艺及其性能

摘要

Hot-melt method is an economical and eco-friendly process that is compatible with continuous online production. A novel modified resole phenolic resin(MPF)was designed with the potential use in the cost-effective hot-melt technique.Differential scanning calorimetry(DSC)and rheometer were employed to determine the curing procedure of MPF.According to the chemorheology and the double Arrhenius theory,viscosity window of MPF was established so that low viscosity platform can be predicted at the op-eration condition.When the viscosity is less than 1000 mPa·s,the temperature of the resin infiltration was 95~135℃.Film-form-ing temperature of MPF was 75~95℃ in the viscosity range of 1000~3000 mPa·s.Low viscosity can maintain 120 min at 75℃. MPF,which residual weight is 68% at 1200℃,exhibited better thermal stability than the pure phenolic resin.The MPF was fabrica-ted using the requirement of hot-melt process with maintained thermal advantageous of the phenolic resin.%针对低成本且环保的热熔预浸工艺,研制一种满足热熔工艺成膜性和高耐热性要求的改性热固性酚醛树脂(MPF)胶膜.采用流变仪和差示扫描量热仪,对MPF的固化反应特性和凝胶特性进行分析,利用粘度预测函数,建立粘度-温度-时间的函数关系模型,预测胶膜树脂的低粘度平台,可指导热熔MPF胶膜的制备及成膜性能研究.为保证树脂充分浸渍纤维,热熔预浸工艺树脂浸润纤维预制体的温度应在95~135℃(粘度小于1000 mPa·s).热熔法MPF胶膜的成膜温度在75~95℃(粘度范围在1000~3000 mPa·s),75℃条件下,MPF低粘度保持时间可达到120 min.固化后的MPF在1200℃的氮气气氛中,残炭率可达到65%.此类新型热熔法MPF可为其在高性能树脂基复合材料领域的应用提供参考.