This paper aims to increasing corona performance of pure polyimide. The research in-volves introducing aluminum nitride ( AlN ) particles into polyimide ( PI ) to prepare promising PI/AlN composite film by employing in situ polymerization;analyzing the microstructure information of composite films by SEM, XRD and synchrotron small angle X ray scattering( SAXS); and determining the thermal stability and corona aging time of composite films The experimental results show that the inorganic nanop-articles are uniformly dispersed in the composite films, resulting in a better compatibility between organic and inorganic phase in composite films;with an increase in the doping content of the nanoparticles comes a significantly increased thermal stability of composite films;an increase in the amount of doped AlN nan-oparticles is followed by a remarkably increase in the corona resistance time of the composite film in the presence of the electric field strength of 80 kV/mm; and in the case of the dopant content of 15% and the corona resistance time up to 75 h. The composite film provides a better thermal stability and compati-bility than pure PI;and 20 times the corona resistance time of PI under the same conditions. It follows that doping of aluminum nitride enables a significant improvement in the corona and thermal stability per-formance of the composite films.%为提高纯聚酰亚胺(PI)的耐电晕性能,利用原位聚合法制备了不同组分无机掺杂的PI与氮化铝(AlN)纳米复合薄膜,通过扫描电镜、XRD及同步辐射小角X射线散射(SAXS)技术分析了无机纳米AlN粒子在聚酰亚胺基体中的分散状态、结晶结构及电晕老化后复合膜的微观形貌,研究了不同AlN掺杂量对复合膜热稳定性和耐电晕性能的影响.结果表明:无机纳米颗粒在复合薄膜中分散均匀,有机与无机相的相容性良好;随纳米颗粒的掺杂含量增加,复合薄膜的热稳定性显著增强;随着掺杂AlN纳米粒子量的增加,复合薄膜在80 kV/mm的电场强度下,耐电晕时间显著提高,当掺杂量为15%时,耐电晕时间高达75 h,为同条件下纯PI膜的20倍.掺杂氮化铝大幅提升了复合薄膜的热稳定性与耐电晕性能.
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