Three-dimensional non-linear finite element analyses have been carried out for piezoelectric laminated beams with piezoelectric actuator partially debonding subjected to applied voltage to study the growth of adhesion failure and delamination behavior. Based on VCCT, a fracture element, named as 3D-VCCT interface fracture element, was developed in conjunction with commercial FEA software ABAQUS by its user-defined element(UEL)feature. The three individual modes energy release rate was calculated with 3D-VCCT interface fracture element and the B-K criteria of delamination growth was used. The influence of the different ply angles of laminated beams and different thickness ratios of laminated beam on the delamination growth behavior was investigated. Based on the calculating results, it is found that the adhesion failure would propagate under mixed mode condition shearing mode of which was the governing mode.%采用三维有限元模型,对在电场作用下部分脱胶的压电复合材料层合梁黏结界面损伤扩展行为进行了研究.建立了基于虚裂纹闭合技术(VCCT)的界面断裂单元,通过有限元软件ABAQUS的用户自定义单元功能UEL实现并计算了脱胶前缘的能量释放率GⅠ,GⅡ和GⅢ,采用B-K准则作为脱胶扩展判据.对部分脱胶的压电复合材料梁在电压作用下对黏结界面脱胶起始和扩展下3种失效模式的能量释放率进行了分析比较,同时对不同铺层形式下,对界面脱胶损伤扩展边缘和内部能量释放率影响进行了对比,还考虑压电驱动器和复合材料层合梁在不同厚度比对界面扩展的影响.结果表明,黏结界面发生以剪切模式为主的混合模式脱胶扩展失效,脱胶边缘易发生Ⅲ型失效,而后向内部扩展以Ⅱ型占主导的脱胶失效.
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