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Application of time-temperature superposition method in thermal aging life prediction of shipboard cables

         

摘要

The life of shipboard cables will decrease due to the complex aging processes. In terms of the safety perspective, remaining life prediction of the cable is essential to maintain a reliable operation. In this paper, firstly, based on Arrhenius equation, residual life of new styrene-butadiene cable is calculated; result indicates that the degradation rate which changes with time is proportional to thermal temperature. Then second order dynamic model is adopted into the residual life prediction, combined with the time-temperature superposition method(TTSP), and a new residual life model is proposed. According to the accelerated thermal aging experiment data and Arrhenius equation, TTSP method demonstrates to be an efficient way for life prediction, and life at normal temperature can be estimated by this model. In order to monitor the state of styrene-butadiene cable more accurately, an improved residual life model based on equivalent environment temperature of cable is proposed, and life of cable under real operation is analyzed. Result indicates that this model is credible and reliable, and it provides an important theoretical base for residual life of cables.

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