可伐合金处理工艺对微晶玻璃-金属封装外壳可靠性的影响

摘要

采用可伐合金和微晶玻璃匹配封装实现的微晶玻璃-金属封装外壳具备气密性好、可靠性高的特点，目前广泛应用于高可靠性微电子封装中，但此类外壳在使用过程中最常出现的可靠性失效类型主要为慢漏气造成的气密性失效和金属引线的延迟性断裂（俗称“断腿”）失效。本文综述了可伐合金处理工艺包括脱碳处理、预氧化和熔封对外壳气密性和抗盐雾能力的影响。%The glass ceramics-metal packages, in which the matching packaging technology of kovar alloy and glass ceramics were adopted, had the characteristics of good hermeticity and high reliability. Currently those were widely used in microelectronics packaging of high reliability. But the hermetic failure for slow leaking and delayed fracture failure of metal lead wires were the main problems of those packages during use. The effect of the kovar alloy process, such as decarburization , preodxidation and sealing on the packages performance of hermeticity and the ability of anti-salt frog, were discussed in this paper.