直线包本机熔胶温度采集算法研究及实现

摘要

针对直线包本机中熔胶温度的测量精度不够以及CPU片内ADC分辨率较低的问题，建立了熔胶温度数学模型，提出了一种低成本的基于ARM微控制器LPC1766的温度采集系统，对过采样技术及防脉冲干扰数字滤波算法进行研究。经实际测试使用，该算法可以在不增加硬件的前提下有效提高直线包本机熔胶温度的测量精度，具有较高的性价比，已投入实际应用。%Due to low accuracy of melt adhesive temperature in package machine and low resolution of ADC within CPU,a mathematical model is developed,a temperature col ectiong system based on microp control er of ARM LPC1766 at low cost is proposed.It develop to study over sampling technology and digital filter of anti pulse jamming.The actual testing and using show that the measuing accuracy of melt adhesive can be improving effctively without adding hardware.