一种高温高压及抽真空试验装置设计

摘要

高温高压及抽真空试验装置针对军工领域硅晶片或其它元件，为检验其可靠性，模拟高温高压及真空恶劣环境下试验需求而研发，以获得被试件各关键数据并进行分析，确保产品可靠性。它集温度系统、压力系统、抽真空系统合为一体，即在同一容器里可模拟完成高温、高压、真空多种测试环境。它解决了之前被试件不能在同一容器内同时完成高温高压及抽真空试验，即不能全面分析试验样品在综合复杂工况下的试验数据，进而影响到试验数据的可靠性。试验装置为可拆式连接方式，方便试验样品的放入和取出，容器腔隔层嵌装加热元件，占空间小、加热迅速、均匀、传热效果好，加热元件由带PID控制模块控制，使温度控制精度高，具有较强的创新理念。%High temperature and high pressure and vacuum pumping in integrated test device aim at the silicon wafer or other component military products, To test its reliability,Research to bad environment simulation test the high temperature and high pressure and vacuum pumping,Acquire component experimental data and analysis,To ensure product reliability.It is integrated with high temperature and high pressure and vacuum pumping,Finished in the same container in simulated high temperature and high pressure and vacuum variety of test en-vironment. it solved Before wos not completed in the same container high temperature and high pressure and vacuum test specimens,Com-prehensive analysis of the product is out of the test data under complex conditions,Which affect the reliability of the data.Test apparatus for a detachable connection, The convenient product puts to go into and takes out, The container interlayer implant heating element heater,Small space,Heat quickly,Uniformity,Spreads the heat,Heating element with PID control module,The temperature control precision is high, Have a stronger innovation principle.