Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education Dalian University of Technology Dalian 116024 China;
Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education Dalian University of Technology Dalian 116024 China;
Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education Dalian University of Technology Dalian 116024 China;
Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education Dalian University of Technology Dalian 116024 China;
CIMS Institute School of Mechanical Engineering Hefei University of Technology Hefei 230009 China;
taping; silicon wafer; backgrinding; subsurface damage; surface roughness;