Room temperature self-healing polyamide was prepared with dimer fatty acid,diethylenetriamine and urea as raw materials. The conductive pure Cobalt (Co) particles were prepared by hydrothermal method,and the conductive particles were doped into the self-healing polyamide system by nano composite technology,then a novel Co-based self-healing polyamide conduc-tive polymer material was obtained through hot molding press. The structures of the pure Co and self-healing polyamide were char-acterized by Fourier transform infrared spectroscopy,X-ray diffraction,scanning electron microscopy and so on. The self-healing ability and anti-swelling properties of the self-healing polyamide,and the electrical conductivity and self-healing performance of the self-healing conductive polymer material were systematically studied. The results show that,average particle size of the prepared pure Co is 3.43 μm,and the surface roughness is easy to be compounded with the self-healing polyamide matrix. The room tem-perature self-healing times of the polyamide matrix can reach more than 20 times,when the content of crosslinking agent urea is 6.6 g/20 g dimer fatty acid or the crosslinking temperature is 145℃,the matrix has better comprehensive anti-swelling properties for water,alkaline solution and oil. When the mass fraction of pure Co reaches 50%,the electronic conductivity of the self-healing con-ductive polymer material has a sudden change and improves dramatically. The addition of Co decreases the self-healing ability of the polymer material but the room temperature self-healing times can still reach more than 10 times when the mass fraction of pure Co is 50%. Because this polymer material has good electrical conductivity and self-healing performance,it is expected to be used in wear-able equipment,electronic devices and other fields.%以二聚脂肪酸、二乙烯三胺、尿素等为原料制备室温自修复型聚酰胺.通过溶液水热法制备导电单质钴颗粒,并采用纳米复合工艺将导电单质钴颗粒掺杂入自修复聚酰胺体系中,经高温模压制得一种新型钴基自修复聚酰胺导电高分子材料.采用傅里叶变换红外光谱仪、X射线衍射仪、扫描电子显微镜等仪器对单质钴和自修复聚酰胺进行结构表征.系统研究了自修复聚酰胺的自修复能力及抗溶胀性能,以及自修复导电高分子材料的导电和自修复性能.结果表明,所制备的单质钴平均粒径为3.43μm,且表面粗糙易于与聚酰胺基体复合;自修复聚酰胺基体在室温下的自修复次数可达20余次;当交联剂尿素用量为6.6 g/20 g二聚脂肪酸或交联温度为145℃时,自修复聚酰胺对水、碱溶液和油具有较好的综合抗溶胀性能.当单质钴质量分数达到50%后,自修复导电高分子材料的导电率发生突变,导电能力大幅提升;单质钴的加入降低了材料的自修复能力,但单质钴质量分数为50%的材料在室温下的自修复次数仍可达10余次.由于这种材料同时具有较好的导电性能和自修复性能,有望应用于可穿戴装备、电子器件等领域.
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