高厚径比PCB深镀能力影响因素的研究

摘要

高厚径比PCB的电镀加工中,深镀能力越来越成为一个重要的评价指标.对比了PCB电镀过程的几种循环方式以及增加振荡对孔内溶液交换的影响,并进行理论分析及实验验证.结果表明:采取底喷以及增加夹具振荡措施可以有效提升高厚径比PCB小孔镀铜的深镀能力.%Throwing power is becoming a more and more important evaluating indicator in plating high aspect ratio printed circuit board (PCB). Several circulation ways used in the process of PCB plating were contrasted; the influence of added vibration on solution exchange in the holes was investigated; theoretical analysis and experimental verification were also made. The results show that throwing power can be effectively improved in copper plating for the small holes of high aspect ratio PCB by taking bottom erupting way and clamp vibrating measures.