酸性镀铜工艺硫酸过量引起的故障分析

摘要

工业生产中,硫酸的过量添加会造成酸性镀铜工艺阳极钝化、槽电压升高、工作电流下降.本文讨论了硫酸对硫酸铜溶解度的影响,发现水溶液中硫酸含量超过50 g/L后硫酸铜的溶解度急剧下降.当硫酸含量过高时,随着电镀过程的进行,CU<'2+>在阳极表面层的浓度不断升高,引起硫酸铜晶体在阳极表面析出,使阳极钝化,导致无法正常生产.%In industrial manufacturing, the exceeding of sulfuric acid in acidic copper plating causes passivation of anode, increase of cell voltage, and decrease of working current. The effect of sulfuric acid content on the solubility of copper sulfate was discussed. The results showed that the solubility of copper sulfate in aqueous solution is decreased rapidly by adding sulfuric acid more than 50 g/L. In electroplating process, the concentration of Cu2+ is increased gradually on anode surface when the content of sulfuric acid is too high. As a result, the anode is passivated and the production is stopped due to the separation of copper sulfate crystals on anode surface.