光敏BCB-苯并环丁烯（benzocyclobutene）具有低介电常数、低介电损耗、低吸湿率、高热稳定性、良好的化学稳定性以及高薄膜平整度和低固化温度等优良的加工性能，在现代微电子制造封装工艺中有非常重要的应用，常用作各类器件钝化防护和层间介电等材料。通常在应用过程中，BCB层上都要形成微细的连接通孔或连接窗口图形。但由于BCB胶对温度非常敏感,且应力因素影响明显，光刻工艺条件比较临界,从而限制了BCB胶的发展和应用，因此优化BCB光刻工艺条件具有重要的实际意义和应用前景。通过控制光刻过程中前烘、光刻及显影等条件，研究了在硅基底表面BCB的成孔工艺。结果表明通过稳定显影条件，适当地提高前烘温度，延长前烘时间和曝光时间，对BCB胶形成图形都有一定的改善。实验中采用矩阵法设计了多组交叉实验，找出最佳前烘及曝光工艺，形成了图形结构良好的光刻图形。%Photosensitive Benzocyclobutene (Photo-BCB) has been widely reported on for use as a dielectric material in multilayer packaging applications. It is with small dielectric constant, low loss tangent, low water absorption, high thermal stabilities and high chemistry reliability, low cure temperature and good planarization properties compared to other media materials. As for these applications, there must be to form connected hole or window patterns. BCB is sensitivity to temperature and stress, photo process window is very margin, it is important to optimize photo process. It was found that BCB was formed patterns more easily with the increasing of soft bake temperature, soft bake time and exposed time, the result shows that best soft bake and expose conditions get high quality photo patterns.
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