基于InCAM软件的LTCC多层基板版图处理

摘要

LTCC多层基板由于其多层布线特点，使得它在高密度多功能微波电路中有广泛应用。在LTCC电路基板生产制造中，需要对其多层（10~30层）布线进行必要的CAM处理，以充分保证LTCC电路设计图形的工艺可制造性和制造中的一致性。针对LTCC多层布线基板的结构及制作工艺特点，介绍运用InCAM软件进行LTCC基板的CAM处理流程，并重点讨论了LTCC基板CAM处理过程的几个要点和自动化脚本在版图处理过程中的应用，对复杂LTCC-3D结构制造前的版图处理具有借鉴意义。%Due to the characteristics of multilayer wiring, LTCC multilayer substrate has been widely used in high density and multi functional microwave circuits. In the production of LTCC circuit board, it is necessary to make the CAM processing to the multilayer (10~30 layers) wiring, in order to ensure the consistency of the process of the LTCC circuit design graphics. Aiming at LTCC multilayer wiring substrate structure and production process characteristics, introduce LTCC substrate processing flow base on InCAM software, discuss a few key points of the LTCC substrate CAM treatment process.