微细硅工具电极的制备及其微细电解加工实验

摘要

提出了一种采用重掺杂单晶硅作为工具电极基体、二氧化硅/氮化硅作为绝缘层的硅工具电极用于微细电解加工.设计了利用体硅湿法腐蚀实现电极基体成形,化学气相沉积制备绝缘层的微细硅工具电极制备工艺.初步实验得到电极加工部尺寸约为100tμm,绝缘层厚度为800 nm的硅工具电极.利用高速旋转的微细硅工具电极在18CrNi8材料上加工出了微细沟槽结构和微细通孔.实验结果验证了侧壁绝缘层对杂散腐蚀抑制作用的有效性.经过96 min的持续加工实验,电极绝缘层保持了可靠的绝缘效果.%A method of silicon-based tool electrode is presented.Heavily doped monocrystalline silicon is used as the electrode body,and silicon dioxide and silicon nitride are deposited as insulating films.A fabrication process of the silicon-based tool electrode is proposed.The electrode body is fabricated by wet etching process and insulation films are produced by low pressure chemical vapour deposition process.Micro silicon-based tool electrodes with dimensions of about 100 μm width and 800 nm thick insulating film are obtained.The silicon-based tool electrode is installed to a rotating head in ECM use,then micro grooves and micro holes are machined on 18CrNi8.The experimental results indicate the feasibility of silicon-based tool electrodes and the effectiveness of the insulating films.After a continuous processing time of 96 minutes,the insulation effect of the insulating film stays the same.