Patterning technology of ferrite and insulating material in multilayer ceramic devices is proposed. In the conventional technology, the different ceramic materials such as the ferrite and the insulating material have been prepared in the form of the each different green sheet, and then they have been stacked each other. Otherwise the different material has filled cavities that were formed by a mechanical punching in advanced. In our proposing technology, arbitrary patterning of the different ceramic material inside the same green sheet is possible. In this process, the arbitrary shape of the through pattern is formed in the green sheet of the base material by making use of photo resist films as sacrifice patterns, and then the base material is masked by the patterned photo resist film. After filling the slurry of the different material into the through pattern of the base material passing the resist mask, the pattern of the different ceramic material in the green sheet is achieved. In the present paper, the ferrite magnetic material and the alumina-glass composite material are used. The patterned structure inside the green sheet is obtained. The slurry preparation, the thickness of the mask resist film, and the obtained structure of the green sheet are discussed.
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