Development of Cutting Condition Monitoring System for ID-blade Saw Slicing Machine

摘要

The purpose of this study is focused on development of an online monitoring system for measuring and evaluating the cutting condition as the ID-blade saw is cutting a silicon ingot. First,the cutting experiments are carried out and the cutting signals during the blade slicing a six-inch ingot are measured by a 3-axes load sensor which is mounted on the top of the ingot. To evaluate the blade condition in slicing,a novel data processing method,combining the discrete Fourier transform(DFT) with the discrete Wavelet transform(DWT),is proposed in this paper for extracting the components due to the rotation of the blade and the cutting impedance. To validate the effect of the method,four ID-blades with three different types of the blade edge are used and discussed. The obtained results show that the component induced from the rotation and the component due to the blade slicing can be extracted efficiently by introduction of the proposed method. Furthermore,a simple online monitoring system,which consists of a 3-axes load sensor or acceleration sensor,DC cuts high-pass filter,and AD converter embedded microcomputer,is designed. The estimated cutting condition information obtained from the proposed monitoring system can be used as a feedback signal to the slicing machine for production of high quality wafer.