双层矩形微板谐振器件中热弹性阻尼机理研究

摘要

基于Bishop和Kinra的理论框架,利用积分变换法,建立了周边固定条件下,双层矩形微板谐振器中热弹性阻尼解析模型.通过与先前解析模型以及有限元数值模型进行比较,验证了本文模型的有效性.结果分析表明:当基层材料与镀层材料的Zener模量相差较大时,热弹性阻尼频谱曲线会出现两个波峰;双层板的厚度对热弹性阻尼有很大的影响;当微板的厚度不变时,所得热弹性阻尼频谱曲线不随其他结构几何参数变化.%Applying the integral-transform technique, this work presented an analytical model for thermoelastic damping in the fully clamped bilayered rectangular microplates based on the framework developed by Bishop and Kinra. The present model was validated by comparison with previously reported model and the FEM model. The results demonstrate that two peak will be found when the Zener's modulus of the substrate is much greater or less than that of the film. The thicknesses of the plates have strong influence on thermoelastic damping, while the thermoelastic dissipation spectrums of the microplates are the same for a given thickness, though their shape, width and length are different.